Laser Squeeze Out Removal
Recover expensive circuit boards from inexpensive solder mask defects. Unwanted solder mask can be selectively laser removed from most areas of a circuit board. It is common to find unintended solder mask on test points, through holes, and ground pads on rigid or flex circuits.
Traditional solder mask removal techniques include grinding and scraping, milling, chemical stripping, and micro blasting. Laser removal of solder mask is safe and repeatable with a finished result leaving no sign of the original solder mask defect. Laser solder mask removal has the following advantages:
- No grinding or scrapping hand fatigue.
- Better accuracy and depth control than milling.
- No harmful chemicals that can deteriorate base dielectrics.
- No masking to protect and control solvent.
- Static-free process to eliminate ESD damage.
- No blasting grit cleaning required.
Micron Laser Technology’s laser solder mask removal processes produce minimal carbon redeposits and prepare the surface for immediate plating, tin, or solder. In some cases, surface prep processes (post laser) like plasma may promote plating adhesion.
Solder mask defined pads can be opened to any desired diameter holding a 25um tolerance. A control depth removal of solder mask can be used to lower solder mask below a metal plane to remedy component or connector reflow issues. Similar control depth solder mask removal eliminates probe tip interferences that cause false opens or failures.
Coverlay Squeeze-out Removal
Cavity Squeeze-out Removal
Gold Bleed Removal