Laser hole drilling of vias, micro holes, pinholes, nozzles, orifices, and slots meet a variety of applications such as instrumentation, print heads, bio-sensors, high-density interconnects, filters, medical devices, and aerospace components. Dimensional and positional tolerances of 5um or better are achieved. MLT laser drilling processes utilize various wavelengths including ultraviolet (UV), infra-red (IR), or hybrid (both UV and IR) depending on the hole diameter and material selection.
Hole quality is subjective to the criteria of the design’s form, fit, and function. Process time or cost may also determine the level of quality required. Laser produced hole quality is assessed in terms of roundness, taper, entrance and exit diameter tolerances, oxidation (i.e. metals), burring or recast layer, and micro-cracking (i.e. glass).
Aspect ratios and material selection are elements that contribute to straight wall or tapered hole profiles. Laser drilling can be used to produce 10um and larger diameter holes in most any material including metals, ceramics, plastics, silicon, rubbers, and glass. MLT laser drilling processes match the optimal wavelength and beam profile for the absorption property of the specified material. These processes are derived from two core laser drilling methodologies, percussion and trepanning.
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