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Recover expensive circuit boards from inexpensive solder mask defects. Unwanted solder mask can be selectively laser removed from most areas of a circuit board. It is common to find unintended solder mask on test points, through holes, and ground pads on rigid or flex circuits.
Traditional solder mask removal techniques include grinding and scraping, milling, chemical stripping, and micro blasting. Laser removal of solder mask is safe and repeatable with a finished result leaving no sign of the original solder mask defect. Laser solder mask removal has the following advantages:
Micron Laser Technology’s laser solder mask removal processes produce minimal carbon redeposits and prepare the surface for immediate plating, tin, or solder. In some cases, surface prep processes (post laser) like plasma may promote plating adhesion.
Solder mask defined pads can be opened to any desired diameter holding a 25um tolerance. A control depth removal of solder mask can be used to lower solder mask below a metal plane to remedy component or connector reflow issues. Similar control depth solder mask removal eliminates probe tip interferences that cause false opens or failures.
CAD system integration and custom file converters enable flexible, laser manufacturing from customer-provided data. Although most file types are accepted, the preferred file types are Gerber, Excellon, DXF, or other 2D formats. In many cases where non-scaled data is required, MLT will make the appropriate scaling or offsets to meet part dimensions.
If you are concerned about compatibility of your data format or CAD/CAM tool, please contact MLT Sales for more information. 503-439-9000 email@example.comCAD / CAM guidelines are outlined in the following links.