Integrated circuits or ICs are bonded to lead-frames or substrates as the interposer. The IC and its wire bonds or CSP bumps are protected from the outside environments by an encapsulation / overmold process. Package types may include BGA, QFN, TSOP, PEM, PiP, SOP, DIP, PLC, MCM and many more.
“Decap” or decapsulation is a failure analysis technique to remove overmolded or encapsulated active components or silicon die (ICs).
MLT laser decap process can selectively remove mold compounds to expose wire bonds, die, leadframes, and substrates.
Decap offers the ability to access the IC for the purpose of electrical test, competitor analysis, counterfeit analysis, bond wire pull testing, and photonic /thermal microscopy for failure analysis.
Despite various numerous electronic package sizes, designs, and materials, the laser decap process is basically dependent on the mold compound itself. Organic mold compounds are easily removed with controlled layer by layer infra-red laser wavelength skiving.
Exposed Wire Bonds
Die Paddle Exposed
Common mold compounds for green and non-green packages include Sumitomo, Hitachi, Mitsubishi, and Loctite to name a few. In many cases, laser decap can leave a die functional and allow for some modification to the package (cut wire bonds) for testing and performance analysis.
MLT’s laser decap services have the advantage of selective area processing combined with energy control that leaves die functional and does not induce too much thermal stress or heat into the package. Please contact our sales staff to discuss your laser decap application.