Micron Laser Technology is an ITAR registered subcontractor of laser processing services for the medical, aerospace, military, automotive and electronics industries.   With twenty laser systems utilizing a wide range of technologies and wavelengths, we successfully satisfy our customers’ most challenging applications with ample capacity to meet their production schedules.  Laser process applications include drilling, high tolerance routing, control depth skiving, and micro machining.

Micron Laser Technology specializes in the laser processing of both rigid and flexible circuits including microvia (uVia) drilling, ZIF routing, squeeze-out removal, window skiving, selective soldermask removal, trace trimming, part marking or scribing, serialization, and cavity formation. Micron Laser Technology is experenced in laser processing most PCB dielectrics and chemistries such as Kapton, polyimide, FR4, Isola, Getek, Nelco, Hitachi, Rogers, Gore, RCC, LCP, ceramics, soldermask, speedboard, epoxy, polyester, Teflon, Mylar, Duroid, acrylics, BT resins, Ultralam, PEEK, PTFE, FEP, and BCB. Other materials laser ablated include aluminum, copper, gold, silver, titanium, molybdenum, stainless steel, nickel, steel, platinum, tungsten, composites, plastics, ceramic, and foam.

Micron Laser Technology's equipment include custom CO2, UV, and YAG laser systems encompassing 266nm, 352nm, 355nm, 532nm, 1064nm, 9.3um, 9.4um, and 10.6um wavelengths. Our systems incorporate high-resolution encoders and galvos that provide a positional accuracy of +/-.0005 and a dimensional tolerance of +/-.001".

We're proud to offer Same Day turntimes!